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PCB Process capability-yifang
Release time：2020-04-01 16:06:47
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| Certificate:CUL,UL(E320003),IATF16949,ISO9001:2008,ISO14001ROHS.SGS,Reach. Normal leadtime:3-15 wds production capability:﹥15000SQM (minum orde:No MOQ) | ||||||
| FR4-PCB production parameter | ||||||
| Project | Mass production | Small volume production | ||||
| Layer | 1-16 | 1-28 | ||||
| Material type | FR-4 | FR-4 | ||||
| Mixed pressure plate | 4--16 Layer | >16 Layer | ||||
| Maximum size | 610mm X 1200mm | 610mm X 1200mm | ||||
| Outline size precision | ±0.13mm | ±0.10mm | ||||
| Board thickness | 0.40mm--7.00mm | 0.2mm and>7.00mm | ||||
| Tolerance of board thickness ( t≥0.8mm) | ±8% | ±5% | ||||
| Tolerance of board thickness ( t＜0.8mm) | ±10% | ±8% | ||||
| Dielectric thickness | 0.075mm--6.00mm | 0.05mm--0.075mm | ||||
| Min. line width/gap | 0.10mm | 0.075mm | ||||
| 0.10mm | 0.075mm | |||||
| Outer cooper thickness | 35um--175um | 35um--210um | ||||
| Inner copper thickness | 17um--175um | 17um--210um | ||||
| Finished hole diameter (Mechanical drilling) | 0.15mm--6.30mm | 0.00mm--0.10mm | ||||
| Laser drilling hole diameter | 0.10mm | 0.075mm | ||||
| Aspect ratio | 10:1 | 12:1;16:1 | ||||
| Min. SM bridge width | 0.10mm | 0.075mm | ||||
| Min. SM spacer ring | 0.05mm | 0.05mm | ||||
| Resistance tolerance | ±10% | ±10% | ||||
| surface treatment | HASL lead free, ENIG, Chemical Tin, Chemical Siliver, OSP | |||||
